Ultra-thin ohmic contacts for p-type nitride light emitting devices

ABSTRACT

A flip-chip semiconductor based Light Emitting Device (LED) can include an n-type semiconductor substrate and an n-type GaN epi-layer on the substrate. A p-type GaN epi-layer can be on the n-type GaN epi-layer and a metal ohmic contact p-electrode can be on the p-type GaN epi-layer, where the metal ohmic contact p-electrode can have an average thickness less than about 25 Å. A reflector can be on the metal ohmic contact p-electrode and a metal stack can be on the reflector. An n-electrode can be on the substrate opposite the n-type GaN epi-layer and a bonding pad can be on the n-electrode.

CLAIM OF PRIORITY AND CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of U.S. patent application Ser.No. 11/191,111, filed Jul. 27, 2005; and is related to U.S. ProvisionalPatent Application No. 60/591,353; Filed Jul. 27, 2004 entitledUltra-Thin Ohmic Contacts for P-Type Nitride Light Emitting Devices byRaffetto et al. and to U.S. Provisional Patent Application No.60/639,705; Filed Dec. 28, 2004 entitled Ultra-Thin Ohmic Contacts forP-Type Nitride Light Emitting Devices by Raffetto, now U.S. Pat. No.8,044,425 issued on Oct. 25, 2011, the disclosures of all of which arehereby incorporated herein by reference in their entireties.

STATEMENT OF GOVERNMENT SUPPORT

This Invention was made with Government support under grant numberDE-FC26-00NT40985 from the Department Of Energy. The Government hascertain rights to this invention.

FIELD OF THE INVENTION

The present invention relates to semiconductor devices, and moreparticularly to light emitting devices having an ohmic contact formed ona Group III nitride-based epitaxial layer.

BACKGROUND

Light emitting diodes and laser diodes are well known solid stateelectronic devices capable of generating light upon application of asufficient voltage. Light emitting diodes and laser diodes may begenerally referred to as light emitting devices (LEDs). Light emittingdevices generally comprise a p-n junction formed in an epitaxial layergrown on a substrate such as sapphire, silicon, silicon carbide, galliumarsenide and the like. The wavelength distribution of the lightgenerated by the LED depends on the material from which the p-n junctionis fabricated and the structure of the thin epitaxial layers thatcomprise the active region of the device.

Typically, an LED includes an n-type substrate, an n-type epitaxialregion formed on the substrate and a p-type epitaxial region formed onthe n-type epitaxial region. In order to facilitate the application of avoltage to the device, an anode ohmic contact is formed on a p-typeregion of the device (typically, an exposed p-type epitaxial layer) anda cathode ohmic contact is formed on an n-type region of the device(such as the substrate or an exposed n-type epitaxial layer).

Because it may be difficult to make highly conductive p-type GroupIII-nitride materials (such as GaN, AlGaN, InGaN, AlInGaN, and AlInN),lack of current spreading in the p-type layer may be a limiting factorin the performance of LEDs formed from such materials. Accordingly, itmay be desirable to form an ohmic contact over as much of the surfacearea of the exposed p-type layer as possible in order to induce currentto pass through as much of the active region of the device as possible.However, providing a large anode contact may be detrimental to deviceperformance in some respects. It is typically desirable to extract asmuch light as possible out of a light emitting diode. Since the anodeohmic contact generally comprises a metal layer, light generated in theactive region of the LED may be partially absorbed in the ohmic contact,reducing the overall luminescent efficiency of the device.

In some devices, it may be desirable to form a reflective metal layerover the exposed p-type layer, so that light that would normally exitthe device through the p-type layer is reflected back into the device tobe extracted through the substrate. However, highly reflective metalssuch as aluminum and silver do not form good ohmic contacts to p-typenitride materials. Thus, an ohmic contact is typically provided betweenthe p-type nitride layer and the reflector. Reducing absorption in theohmic contact remains a concern in such devices.

Accordingly, there is a need for improved ohmic contact structures andmethods of forming ohmic contact structures on p-type nitride materials.

SUMMARY

Embodiments according to the invention can provide ultra-thin ohmiccontacts for p-type nitride light emitting devices and methods offorming. Pursuant to these embodiments, a semiconductor based LightEmitting Device (LED) can include a p-type nitride layer and a metalohmic contact, thereon, where the metal ohmic contact has an averagethickness of less than about 25 Å and a specific contact resistivityless than about 10⁻³ ohm-cm². The metal ohmic contact can comprise Pt.

In some embodiments according to the invention, the metal ohmic contacthas an average thickness less than about 20 Å. In some embodimentsaccording to the invention, the metal ohmic contact has an averagethickness between about 13 Å and about 18 Å. In some embodimentsaccording to the invention, the metal ohmic contact has an averagethickness of about 15 Å. In some embodiments according to the invention,the metal ohmic contact has an average thickness less than about 10 Å.

In some embodiments according to the invention, the metal ohmic contactcovers less than about 67% of the p-type nitride layer measured via anAuger analysis of the metal ohmic contact. In some embodiments accordingto the invention, the metal ohmic contact covers a portion of the p-typenitride layer and a remaining portion of the p-type nitride layer isun-covered by the metal ohmic contact.

In some embodiments according to the invention, the metal ohmic contacthas an average thickness less than about 5 Å. In some embodimentsaccording to the invention, the metal ohmic contact covers less thanabout 47% of the p-type nitride layer measured via an Auger analysis ofthe metal ohmic contact.

In some embodiments according to the invention, a normalizedtransmissivity of the metal ohmic contact is about 92% at a measurementwavelength of about 350 nm. In some embodiments according to theinvention, the metal ohmic contact covers a portion of the p-typenitride layer and a remaining portion of the p-type nitride layer isun-covered by the metal ohmic contact.

In some embodiments according to the invention, the metal ohmic contacthas an average thickness less than about 3 Å. In some embodimentsaccording to the invention, the metal ohmic contact covers less thanabout 28% of the p-type nitride layer measured via an Auger analysis ofthe metal ohmic contact.

In some embodiments according to the invention, the normalizedtransmissivity of the metal ohmic contact is about 94% to about 96% at ameasurement wavelength of about 350 nm. In some embodiments according tothe invention, the metal ohmic contact has an average thickness of about1 Å. In some embodiments according to the invention, the metal ohmiccontact covers less than about 13% of the p-type nitride layer measuredvia an Auger analysis of the metal ohmic contact. In some embodimentsaccording to the invention, a normalized transmissivity of the metalohmic contact is more than about 98% at a measurement wavelength ofabout 350 nm.

In some embodiments according to the invention, the metal ohmic contactcan be platinum, rhodium, zinc oxide, palladium, palladium oxide,titanium, nickel/gold, nickel oxide/gold, nickel oxide/platinum and/ortitanium/gold. In some embodiments according to the invention, the LEDcan also include a bonding pad on the metal ohmic contact.

In some embodiments according to the invention, an LED can include ap-type nitride layer and a metal ohmic contact, thereon, where the metalohmic contact has an average thickness of about 1 Å. In some embodimentsaccording to the invention, and LED can include a p-type nitride layerand a metal ohmic contact thereon. The metal ohmic contact can have anaverage thickness of about 1 Å that covers about 13% of the p-typenitride layer measured via an Auger analysis of the metal ohmic contact.

In some embodiments according to the invention, an LED includes a p-typenitride layer and a metal ohmic contact thereon. The metal ohmic contactcan have an average thickness sufficient to provide a normalizedtransmissivity of more than about 98% at a measurement wavelength ofabout 350 nm.

In some embodiments according to the invention, a method of forming asemiconductor based Light Emitting Device (LED) can be provided byforming a p-type nitride layer on an n-type substrate, forming a metalohmic contact on the p-type nitride layer to an average thickness lessthan about 25 Å and a specific contact resistivity less than about 10⁻³ohm-cm², and ceasing forming the metal ohmic contact.

In some embodiments according to the invention, foaming a metal ohmiccontact can further include depositing metal on the p-type nitride layerand on a witness slide for a time interval at a rate to provide a metallayer having a first average thickness for the metal ohmic contact andan indication of thickness of the metal layer on the witness slide ismonitored. Metal is further deposited for subsequent time interval(s)and/or subsequent rate(s) to increase the average thickness if theindication is above a predetermined indication threshold. Deposition ofthe metal is ceased if the indication is about equal to or below thepredetermined indication threshold.

In some embodiments according to the invention, the monitoring of theindication of thickness is provided by measuring transmissivity, sheetresistivity, capacitance, reflectance, and/or resonant frequency of themetal layer. In some embodiments according to the invention, the metalis further deposited until the indication exceeds the predeterminedindication threshold. In some embodiments according to the invention,the rate of deposition is about 0.1 Å to about 0.5 Å per second.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional drawing illustrating some embodiments of theinvention.

FIGS. 2A and 2B are top views of LED dice having ohmic contacts inaccordance with some embodiments of the invention.

FIG. 3 is a cross-sectional drawing illustrating further embodiments ofthe invention.

FIG. 4 is a flowchart illustrating method embodiments of the invention.

FIG. 5 is a graph of the transmissivity of platinum films of variousthicknesses as measured over a range of wavelengths.

FIG. 6 is a flowchart illustrating further method embodiments of theinvention.

FIG. 7 is a flowchart illustrating further method embodiments of theinvention.

FIG. 8 is a schematic diagram of a film deposition system in accordancewith some embodiments of the invention.

FIGS. 9A and 9B are scanning transmission electron microscope (STEM)images of a Pt contact layer having an average thickness of about 10 Åaccording to some embodiments of the present invention.

FIGS. 10A and 10B are STEM images of a Pt contact layer having anaverage thickness of about 3 Å according to some embodiments of thepresent invention.

FIGS. 11A and 11B are STEM images of a Pt contact layer having anaverage thickness of about 1 Å according to some embodiments of thepresent invention.

DESCRIPTION OF EMBODIMENTS ACCORDING TO THE INVENTION

The present invention now will be described more fully hereinafter withreference to the accompanying drawings, in which embodiments of theinvention are shown. This invention should not be construed as limitedto the embodiments set forth herein; rather, these embodiments areprovided so that this disclosure will be thorough and complete, and willfully convey the scope of the invention to those skilled in the art.Like numbers refer to like elements throughout.

Furthermore, the various layers and regions illustrated in the figuresare illustrated schematically. As will also be appreciated by those ofskill in the art, while the present invention is described with respectto semiconductor wafers and diced chips, such chips may be diced intoarbitrary sizes. Accordingly, the present invention is not limited tothe relative size and spacing illustrated in the accompanying figures.In addition, certain features of the drawings such as layer thicknessesand feature sizes are illustrated in exaggerated dimensions for clarityof drawing and ease of explanation.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like numbers refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present invention.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother elements as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in the Figures is turned over, elements describedas being on the “lower” side of other elements would then be oriented on“upper” sides of the other elements. The exemplary tens “lower”, cantherefore, encompasses both an orientation of “lower” and “upper,”depending of the particular orientation of the figure. Similarly, if thedevice in one of the figures is turned over, elements described as“below” or “beneath” other elements would then be oriented “above” theother elements. The exemplary terms “below” or “beneath” can, therefore,encompass both an orientation of above and below.

As used herein in connection with the thickness of ohmic contacts, theterm “about” means within a tolerance of +/−1 Å.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that twins, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andthis specification and will not be interpreted in an idealized or overlyformal sense unless expressly so defined herein.

Embodiments of the present invention are described herein with referenceto cross-section illustrations that are schematic illustrations ofidealized embodiments of the present invention. As such, variations fromthe shapes of the illustrations as a result, for example, ofmanufacturing techniques and/or tolerances, are to be expected. Thus,embodiments of the present invention should not be construed as limitedto the particular shapes of regions illustrated herein but are toinclude deviations in shapes that result, for example, frommanufacturing. For example, a region illustrated as a rectangle will,typically, have rounded, curved or graded features at its edges ratherthan a discrete change from one region to the next. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region of a device andare not intended to limit the scope of the present invention.

Embodiments of the invention now will be described, generally withreference to gallium nitride-based light emitting diodes on siliconcarbide-based substrates. However, it will be understood by those havingskill in the art that many embodiments of the invention may be employedwith many different combinations of substrate and epitaxial layers. Forexample, combinations can include AlGaInP diodes on GaP substrates;InGaAs diodes on GaAs substrates; AlGaAs diodes on GaAs substrates; SiCdiodes on SiC or sapphire (Al₂O₃) substrates; and/or nitride-baseddiodes on gallium nitride, silicon carbide, aluminum nitride, sapphire,zinc oxide and/or other substrates.

GaN-based light emitting devices typically comprise an insulating,semiconducting or conductive substrate such as SiC or sapphire on whicha plurality of GaN-based epitaxial layers are deposited. The epitaxiallayers comprise an active region having a p-n junction that emits lightwhen energized.

Although various embodiments of LEDs disclosed herein include asubstrate, it will be understood by those skilled in the art that thecrystalline epitaxial growth substrate on which the epitaxial layerscomprising an LED are grown may be removed, and the freestandingepitaxial layers may be mounted on a substitute carrier substrate orsubmount which may have better thermal, electrical, structural and/oroptical characteristics than the original substrate. The inventiondescribed herein is not limited to structures having crystallineepitaxial growth substrates and may be utilized in connection withstructures in which the epitaxial layers have been removed from theiroriginal growth substrates and bonded to substitute carrier substrates.

Light emitting devices for use in embodiments of the present inventionmay be gallium nitride based light emitting diodes or lasers fabricatedon a silicon carbide substrate such as those devices manufactured andsold by Cree, Inc. of Durham, N.C. For example, the present inventionmay be suitable for use with LEDs and/or lasers as described in U.S.Pat. Nos. 6,740,906, 6,734,033, 6,664,560, 6,201,262, 6,187,606,6,120,600, 5,912,477, 5,739,554, 5,631,190, 5,604,135, 5,523,589,5,416,342, 5,393,993, 5,338,944, 5,210,051, 5,027,168, 5,027,168,4,966,862 and/or 4,918,497, the disclosures of which are incorporatedherein by reference as if set forth fully herein. Other suitable LEDsand/or lasers are described in United States Patent Publication No.2003/0006418, entitled “GROUP III NITRIDE BASED LIGHT EMITTING DIODESTRUCTURES WITH A QUANTUM WELL AND SUPERLATTICE, GROUP III NITRIDE BASEDQUANTUM WELL STRUCTURES AND GROUP III NITRIDE BASED SUPERLATTICESTRUCTURES,” and U.S. patent application Ser. No. 10/899,791 (AttorneyDocket No. 5308-2041P), entitled “GROUP III NITRIDE BASED QUANTUM WELLLIGHT EMITTING DEVICE STRUCTURES WITH AN INDIUM CONTAINING CAPPINGSTRUCTURE,” filed Jul. 27, 2004, U.S. patent application Ser. No.10/881,814 (Attorney Docket No. 5308-457) entitled “LIGHT EMITTINGDEVICES HAVING CURRENT BLOCKING STRUCTURES AND METHODS OF FABRICATINGLIGHT EMITTING DEVICES HAVING CURRENT BLOCKING STRUCTURES,” filed Jun.30, 2004 and/or U.S. patent application Ser. No. 10/899,793 (AttorneyDocket No. 5308-468) entitled “LIGHT EMITTING DEVICES HAVING AREFLECTIVE BOND PAD AND METHODS OF FABRICATING LIGHT EMITTING DEVICESHAVING A REFLECTIVE BOND PAD,” filed Jul. 27, 2004, the disclosures ofwhich are incorporated herein as if set forth fully.

In particular embodiments of the present invention, the light emittingdevices may include a p-electrode that provides a reflecting layer toreflect light generated in the active region back through the device.Reflective p-electrodes and related structures are described in U.S.Patent Publication No. 2003/0123164 entitled “LIGHT EMITTING DIODESINCLUDING SUBSTRATE MODIFICATIONS FOR LIGHT EXTRACTION AND MANUFACTURINGMETHODS THEREFOR” and in U.S. Patent Publication No. 2003/0168663entitled “REFLECTIVE OHMIC CONTACTS FOR SILICON CARBIDE INCLUDING ALAYER CONSISTING ESSENTIALLY OF NICKEL, METHODS OF FABRICATING SAME, ANDLIGHT EMITTING DEVICES INCLUDING THE SAME,” the disclosures of which arehereby incorporated by reference as if set forth fully herein.

As used herein the term “ohmic contact” refers to contacts where animpedance associated therewith is substantially given by therelationship of Impedance=V/I, where V is a voltage across the contactand I is the current, at substantially all expected operatingfrequencies (i.e., the impedance associated with the ohmic contact issubstantially the same at all operating frequencies). For example, insome embodiments according to the invention, an ohmic contact can be acontact with a specific contact resistivity of less than about 10⁻⁰³ohm-cm² and, in some embodiments less than about 10⁻⁰⁴ ohm-cm². Thus, acontact that is rectifying or that has a high specific contactresistivity, for example, a specific contact resistivity of greater thanabout 10⁻⁰³ ohm-cm², is not an ohmic contact as that term is usedherein.

An LED may be mounted substrate side down onto a submount such as ametal plate, printed circuit board or lead frame (all of which arereferred to herein as a “submount”). FIG. 1 schematically illustrates anLED 1 having an n-type SiC substrate 10, an active region 12 comprisingan n-GaN-based layer 14 and a p-GaN-based layer 16 grown on thesubstrate and patterned into a mesa. A metal p-electrode 18 is depositedon and electrically coupled to the p-GaN layer 16 and a wire bondconnection 28 is made to a bond pad 20 on the p-electrode 18. Ann-electrode 22 on and electrically coupled to the conductive substrateis attached to conductive submount 24 using a conductive epoxy 26. Theepoxy 26 is heat cured which causes it to harden, providing a stable andelectrically conductive mount for the LED chip. Light generated in theactive region 12 is directed up and out of the device. However, aportion of the generated light may be absorbed by the ohmic p-electrode18 (sometimes referred to herein as the ohmic contact 18).

In order to reduce and/or minimize absorption of light by thep-electrode 18, the thickness of the p-electrode can be reduced below 25Å in accordance with some embodiments of the present invention. Someembodiments of the present invention provide an ultrathin p-contactmetal that may be deposited in a way that is reproducible, controllable,and manufacturable. In some embodiments, the ohmic contact 18 comprisesplatinum. Other materials may be used for the ohmic contact 18. Forexample, the ohmic contact 18 may comprise rhodium, zinc oxide,palladium, palladium oxide, titanium, nickel/gold, nickel oxide/gold,nickel oxide/platinum and/or titanium/gold, In some embodiments, theohmic contact 18 has an average thickness less than 25 Å. In furtherembodiments, the ohmic contact 18 has an average thickness less than 20Å. In some embodiments, the ohmic contact 18 may have an averagethickness between 13 and 18 Å. In further embodiments, the ohmic contact18 may have an average thickness of about 15 Å+/−1 Å. In someembodiments, the ohmic contact 18 has an average thickness less than 10Å. In some embodiments, the ohmic contact 18 has an average thicknessless than 5 Å, and in further embodiments, the ohmic contact 18 has anaverage thickness less than 3 Å. In still further embodiments, the ohmiccontact has an average thickness of about 1 Å.

It will be understood by those skilled in the art that film thicknessesless than 10 Å, and in particular film thicknesses less than 5 Å, mayrepresent partial or sub-monolayer coverage of the surface. Thus, eventhough the resulting layer is referred to as a “film”, the film may onlypartially cover the surface of the p-type GaN layer. Furthermore, someof uncovered portions of the p-type GaN layer can be characterized as“exposed” as those portions are not covered by a film thicker than theminimum average thickness of the metal ohmic contact (e.g., the exposedportions are covered by a sub-monolayer of the metal ohmic contact).

Thus, some embodiments of the present invention provide a contact layerwith coverage of less than 70%. Further embodiments of the presentinvention provide a contact layer with coverage of less than 50%. Stillfurther embodiments of the present invention provide a contact layerwith coverage of less than 30%. Additional embodiments of the presentinvention provide a contact layer with coverage of less than 20%. Asused herein, when the metal ohmic contact is described as covering“only” a particular percentage of the p-type nitride layer (e.g., 70%)it will be understood that the remaining portion (e.g., 30%) of thep-type nitride layer can be un covered (i.e., exposed) or covered byportions of the metal ohmic contact which are less than the averagethickness of the metal ohmic contact covering the p-type nitride layer.Furthermore, these percentages of coverage are not to be interpreted toinclude portions of the p-type nitride which are not beneath the outeredges of the metal ohmic contact (e.g, such as an oversized p-typenitride layer).

Ohmic contacts according to some embodiments of the present inventionmay be formed by electron beam (e-beam) evaporation or any othersuitable techniques for controllably forming atomically thin metallicfilms. For example, it may be possible to form the ohmic contacts byelectroplating provided adequate process control is maintained. Inelectron beam evaporation, a metal source target is heated in a vacuumchamber to the point of vaporization by a high intensity electron beamwhich melts a region of the target. An epitaxial wafer placed within thechamber is controllably coated with vaporized metal. E-beam evaporationand other film deposition methods are described in Chapter 6 ofINTRODUCTION TO MICROELECTRONIC FABRICATION by R. Jaeger (2nd Ed. 2002).

The deposition rate of the process may be controlled by changing thecurrent and energy of the electron beam. In some embodiments, thedeposition rate is maintained at a low rate, e.g. in the range of0.1-0.5 Å per second in order to maintain adequate control of filmthickness. In addition, the film deposition may be controlled duringdeposition by monitoring the transmission properties of a witness slideon which the ohmic metal film is simultaneously deposited. The witnessslide may be sapphire, quartz, or any other optically transmissivematerial on which a metal film may be deposited. The transmissionsensitivity to the metal thickness is dependent upon the wavelength ofthe light used in the monitoring process. Namely, the transmissionsensitivity may be enhanced at shorter wavelengths. Accordingly, in someembodiments, the transmission properties of a sapphire witness slide aremeasured during or after film deposition by means of a monitoring systememploying a UV source capable of emitting light at wavelengths of 350 nmor less, such as a UV spectrophotometer. The slow deposition rate mayallow for reproducible and controllable deposition of the thin layer.

The ohmic contact 18 may have a thickness range of 1-25 Å. For platinumcontacts to flip-chip devices, the preferred thickness is 1-5 Å.Flip-chip devices typically include additional metal layers blanketdeposited on the ohmic contact. For example, there may be a reflectorlayer 30 illustrated in FIG. 3, as well as barrier, bonding, and/oradhesion layers which form metal stack 32. Accordingly, currentspreading may occur in the reflector layer 30 and/or metal stack 32. Forplatinum contacts to non-flip-chip devices, the preferred thickness is13-18 Å, and a bond pad including metal current spreading fingers isformed on the ohmic contact 18.

Once deposited, the ohmic contact 18 provides an ohmic or non-rectifyingcontact “as deposited.” That is, no further processing or annealing maybe required in order to provide a quasi-ideal electrical contact to thep-type GaN layer 16. However, in some cases it may be necessary ordesirable to anneal the ohmic contact 18 or perform otherpost-deposition processing in order to improve its ohmic characteristics(such as to reduce the specific contact resistance of the contact layer,for example).

In some embodiments, methods according to the present invention includeforming an n-type epitaxial layer on a substrate, forming a p-typeepitaxial layer on the n-type epitaxial layer to thereby provide adevice precursor structure, placing the device precursor structure in ane-beam evaporation system, placing a witness slide in the evaporationsystem, and forming a layer of platinum on the device precursorstructure and the witness slide while simultaneously monitoring thetransmissivity of the metal film on the witness slide. In someembodiments, deposition of the ohmic contact metal may be halted beforethe normalized transmissivity of the metal film on the witness slidefalls below 98% at a measurement wavelength of 350 nm. In otherembodiments, deposition of the ohmic contact metal may be halted beforethe normalized transmissivity of the metal film on the witness slidefalls below 96% at a measurement wavelength of 350 nm. In furtherembodiments, deposition of the ohmic contact metal may be halted beforethe normalized transmissivity of the metal film on the witness slidefalls below 92% at a measurement wavelength of 350 nm.

As illustrated in FIG. 5, the normalized transmissivity of a metal filmdeposited on a witness slide varies depending on the thickness of thefilm and the wavelength of light used in the measurement. Stateddifferently, the absorptivity of the metal film is a function of boththe film thickness and the wavelength of light passing through the film.As is apparent from the graph of FIG. 5, the greatest variation inabsorptivity as a function of thickness occurs at lower wavelengths. Forexample, at a wavelength of 350 nm, a 1 Å platinum film exhibits atransmissivity of between 98 and 100%, while a film having an averagethickness of 3 Å exhibits a transmissivity of between 94 and 96%, and afilm having an average thickness of 5 Å exhibits a transmissivity ofabout 92%. The effect is even more pronounced at lower wavelengths.

Accordingly, in some embodiments, the transmission properties of asapphire witness slide are monitored during film deposition by means ofa monitoring system employing a UV source capable of emitting light atwavelengths of 350 nm or less. By monitoring in situ the transmissivityof a metal film formed on a calibrated witness slide, the depositionprocess may be halted before or after the transmissivity of the metalfilm reaches a predetermined threshold level. Accordingly, thedeposition of extremely thin metal films may be controlled with a highdegree of precision according to embodiments of the invention.

In some embodiments, deposition of the ohmic contact may be haltedbefore the normalized transmissivity of the metal film on the witnessslide falls below 98% at a measurement wavelength of 350 nm. In otherembodiments, deposition of the ohmic contact may be halted before thenormalized transmissivity of the metal film on the witness slide fallsbelow 96% at a measurement wavelength of 350 nm. In further embodiments,deposition of the ohmic contact may be halted before the normalizedtransmissivity of the metal film on the witness slide falls below 92% ata measurement wavelength of 350 nm.

Other methods of monitoring the thickness of the deposited metal filmmay be employed. For example, other physical, electrical or opticalcharacteristics of the film (or the material on which the film isdeposited) which vary according to film thickness may be measured andcompared against known standards to determine film thickness. Suchcharacteristics may include, but are not limited to, sheet resistivity,capacitance, or reflectance of the film. In one embodiment, the resonantfrequency of a quartz crystal coated with the evaporating materialduring deposition is monitored. The resonant frequency of the crystalshifts in proportion to the thickness of the deposited film and mayprovide a sufficiently accurate measure of film thickness. See Chapter 6of INTRODUCTION TO MICROELECTRONIC FABRICATION by R. Jaeger (2nd Ed.2002).

In order to facilitate current spreading, the bond pad may include oneor more current spreading fingers extending across portions of the ohmiccontact. As illustrated in FIGS. 2A and 2B, the bond pad 20 formed onthe ohmic contact 18 may include one or more current spreading fingers21 which extend from the bond pad 20 across portions of the ohmiccontact 18. The current spreading fingers 21 may be straight asillustrated in FIG. 2A or curved as shown in FIG. 2B. Otherconfigurations are possible. Although the embodiments illustrated inFIGS. 2A and 2B include four fingers 21 each, a greater or smallernumber of fingers 21 may be used depending on the amount of currentspreading desired.

FIG. 3 illustrates other LEDs according to some embodiments of theinvention in which the LED is designed to be flip-chip mounted (i.e.mounted substrate side up). FIG. 3 schematically illustrates an LED 2having an n-type SiC substrate 10, an active region 12 comprising ann-GaN-based layer 14 and a p-GaN-based layer 16 grown on the substrateand patterned into a mesa. A metal p-electrode 18 is deposited on andelectrically coupled to the p-GaN layer 16 and a wire bond connection 28is made to a bond pad 20 on the p-electrode 18. An n-electrode 22 on andelectrically coupled to the conductive substrate 10 includes a bond pad20 to which a wire bond connection 28 is made. In the embodiment of FIG.3, the LED further includes a reflector 30. A metal stack 32 such as themetal stacks described in the above-referenced U.S. Pat. No. 6,740,906is formed on reflector 30 to provide barrier, adhesion and/or bondinglayers for example. The entire device is then mounted on a submount 24by means of solder 34.

In order to reduce or minimize absorption of light by the p-electrode 18so that more light can be reflected by reflector 30, the thickness ofthe p-electrode is reduced below 25 Å in accordance with the invention.In some embodiments, the p-electrode 18 comprises platinum. Othermaterials may be used for the ohmic contact 18. For example, the ohmiccontact 18 may comprise rhodium, zinc oxide, palladium, palladium oxide,titanium, nickel/gold, nickel oxide/gold, nickel oxide/platinum and/ortitanium/gold. In some embodiments, the ohmic contact 18 has an averagethickness less than 25 Å. In further embodiments, the ohmic contact 18has an average thickness less than 20 Å. In some embodiments, the ohmiccontact 18 may have an average thickness between 13 and 18 Å. In furtherembodiments, the ohmic contact 18 may have an average thickness of about15 Å. In some embodiments, the ohmic contact 18 has an average thicknessless than 10 Å. In some embodiments, the ohmic contact 18 has an averagethickness less than 5 Å, and in further embodiments, the ohmic contact18 has an average thickness less than 3 Å. In still further embodiments,the ohmic contact 18 has an average thickness of about 1 Å. In someembodiments, the ohmic contact 18 has an average thickness less than 10Å and a coverage of less than about 70%. In some embodiments, the ohmiccontact 18 has an average thickness less than 5 Å and a coverage of lessthan about 50% and in further embodiments, the ohmic contact 18 has anaverage thickness less than 3 Å and a coverage of less than about 30% Instill further embodiments, the ohmic contact 18 has an average thicknessof about 1 Å and a coverage of less than about 15%.

The reflector 30 preferably is thicker than about 300 Å and preferablycomprises aluminum and/or silver. Embodiments of FIG. 3 can provideimproved current spreading, since the reflector 30 contacts the thintransparent ohmic contact 18 over the entire surface area of the thintransparent ohmic contact 18. Thus, current need not travel horizontallythrough the ohmic contact 18, as may be the case in other embodiments.Current spreading thus may be enhanced in this embodiment. Other contactstructures may be used, for example, those described in detail in U.S.Pat. No. 6,740,906. As discussed above, highly reflective materials suchas Al and Ag may make poor ohmic contacts to p-type GaN. Although thephenomenon has not been fully investigated, it is believed thatproviding an ultrathin layer of platinum between a p-type GaN layer anda silver reflector may reduce the work function of the silver at theinterface sufficient to allow formation of a satisfactory ohmic contactbetween the reflector and the p-type GaN while maintaining a high degreeof reflectivity.

Embodiments of the invention may reduce the optical losses in the LEDsthat result from absorption in the p-contact metal. The p-contact metalmay be required to make an ohmic contact with a minimal voltage drop,but typically the contact metal introduces optical losses. Embodimentsof the present invention may provide a contact with low optical loss,low contact resistance, and good metal-semiconductor adhesion suitablefor high brightness nitride LEDs that employ either reflective ortransparent p-side metal stacks. By reducing the p-contact metal to anextremely thin layer (e.g. 1.5 vs 25 Å of Pt), light output of a devicemay be increased substantially. For example, an improvement in lightoutput of approximately 10% was achieved in a 300×300 μm square chip andan improvement of approximately 20% was achieved in a 900×900 μm squarechip. The increased brightness levels may speed the introduction ofsolid state lighting sources into products for general illumination andother specialty illumination applications, such as automotive headlamps.

FIG. 4 illustrates method embodiments of the invention. As illustratedin FIG. 4, method embodiments may include fabricating a GaN based lightemitting device precursor structure in step 100. The step of fabricatinga GaN based light emitting device precursor structure may includeforming an n-type epitaxial layer on a substrate and forming a p-typeepitaxial layer on the n-type epitaxial layer. In step 105, the methodincludes placing the device precursor structure and a witness slide inmetal film deposition system such as an e-beam evaporation system.Continuing with step 110, the method includes depositing a metal film onthe device precursor structure and the witness slide. The transmissivityof the metal film on the witness slide is measured in step 115. If thetransmissivity of the film reaches or falls below a predefined threshold(decision block 120), the process is halted. Otherwise, metal filmdeposition is continued (step 110).

In some embodiments, deposition of the ohmic contact metal may be haltedbefore the normalized transmissivity of the metal film on the witnessslide falls below 98% at a measurement wavelength of 350 nm. In otherembodiments, deposition of the ohmic contact metal may be halted beforethe normalized transmissivity of the metal film on the witness slidefalls below 96% at a measurement wavelength of 350 nm. In furtherembodiments, deposition of the ohmic contact metal may be halted beforethe normalized transmissivity of the metal film on the witness slidefalls below 92% at a measurement wavelength of 350 nm.

Some embodiments of the invention include fabricating a GaN based LEDprecursor structure, placing the precursor structure along with a testsubstrate such as a witness slide into a metal film deposition system,depositing a metal film on the precursor structure and the testsubstrate for a predetermined time at a predetermined deposition rate,and measuring the transmissivity of the film on the test substrate. Ifthe transmissivity of the film is below a predetermined threshold(indicating that the metal film is too thick), the metal film is removedfrom the precursor structure, the precursor is placed back into the filmdeposition system, and a metal film is deposited on the precursorstructure for a second predetermined time and/or deposition rate. Theprocess may be repeated any number of times until an acceptablethickness has been deposited.

As illustrated in FIG. 6, some embodiments of the invention include thesteps of fabricating a GaN based LED precursor structure (step 200). Theprecursor structure is placed into a film deposition system along with awitness slide or other test substrate (step 205). A metal film is thendeposited on the precursor structure and the witness slide (step 210).The thickness of the film on the witness slide is then measured (step215) for example by measuring the transmissivity of the film. If thetransmissivity is below a predetermined threshold (indicating that thefilm is too thick) (step 220), then the metal film may be removed fromthe structure (for example by etching) and the precursor structure isplaced back into the film deposition system.

In other embodiments illustrated in FIG. 7, the film thickness may becontrolled by performing calibrating runs on test materials within thedeposition system to determine the appropriate duration and rate of thedeposition step. Accordingly, some embodiments of the invention includefabricating a GaN based LED precursor structure (step 300) placing atest substrate into a film deposition system (step 305), depositing ametal film on the test substrate for a predetermined time at apredetermined deposition rate (step 310), and measuring the thickness ofthe resulting film (step 315). If the film thickness falls within apredetermined desired range (step 320), a GaN based LED precursorstructure is placed into the film deposition system (step 325) and ametal film is deposited on the precursor structure for the predeterminedtime and rate (step 330). If the film thickness is not within thepredetermined range, then a second test substrate (or a reconditionedfirst test substrate) may be placed into the film deposition system(step 305) and a second film is deposited on the second test substratefor a second predetermined time and/or rate.

In further embodiments, the monitoring system may provide a signaloutput to the film deposition system when the film thickness reaches athreshold level. The film deposition system may stop the depositionprocess in response to the signal output from the monitoring system toprovide automatic closed-loop control of the deposition process. FIG. 8is a schematic diagram of a film deposition system 50 in accordance withembodiments of the invention. System 50 includes a vacuum chamber 52 inwhich a wafer carrier 54 is mounted. Wafer 56, on which the metal filmwill be deposited, is mounted on wafer carrier 54 along with a witnessslide or test structure 70. Vacuum pump system 58 is coupled to thevacuum chamber 52 for pumping gas out of the chamber. Vacuum pump system58 may comprise multiple pumps and gauges (not shown) to reduce thepressure inside vacuum chamber 52 to less than 10⁻³ Pa.

An e-beam generator 60 within the vacuum chamber generates a beam ofelectrons at a predetermined energy and directs the beam toward sourcetarget 64. E-beam generator 60 is controlled by e-beam controller 62.When the electron beam generated by e-beam generator 60 strikes thesource target 64, source material evaporates from source target 64 andredeposits on wafer 56 and witness slide 70. A sensor 66 which may bemounted inside or outside the vacuum chamber measures the thickness ofthe deposited film by monitoring physical, electrical or opticalcharacteristics of the witness slide which vary according to filmthickness may be measured and compared against known standards todetermine film thickness. As discussed above, such characteristics mayinclude transmissivity, reflectivity, conductivity, resonant frequencyor other characteristics. Sensor 66 is controlled by sensor controller68 (which may in practical applications be the same as e-beam controller62). When sensor 66 detects that the deposited film thickness hasreached a predetermined threshold, the monitoring system may provide asignal output to the e-beam controller 62, causing the e-beam controllerto stop the deposition process. Accordingly, a system 50 in accordancewith embodiments of the invention may provide automatic closed-loopcontrol of the deposition process.

Contact layers were fabricated as described above at thicknesses of 25Å, 10 Å, 3 Å and 1 Å. The contact layers were Pt. The 25 Å layer wasassumed to be a continuous layer of Pt. STEM images were obtained forthe 10 Å, 3 Å and 1 Å layers. The STEM images are shown in FIGS. 9A, 10Aand 11A. The STEM images show a distinct change in the amount of Pt from10 Å (FIG. 9A) (>>50% coverage) to 1 Å (FIG. 11A) (<<50% coverage). Inan attempt to quantify the amount of Pt, a threshold technique thatremoves the gray scale such that a pixel value above a certain value isassigned pure white (Pt) and a pixel value below a certain value getsassigned pure black was applied to the STEM images. The images afterthresholding are seen in FIGS. 9B, 10B and 11B. While the selection ofthe threshold value may be subjective, comparing the thresholded imageto the original, the fit appears to be consistent. By taking the ratioof black (no Pt) to white (Pt) an indication of coverage may beobtained. Table 1 below shows the analysis of the STEM images in FIGS.9B, 10B and 11B.

TABLE1 STEM Analysis Sample 1500 kX B/W Ratio Approximate Pt Coverage 10Å 0.6406 0.61  3 Å 1.9924 0.33  1 Å 11 0.08

Auger surface analysis was also performed on the Pt layers. The resultsof the Auger surface analysis is shown in Table 2.

TABLE 2 Auger Analysis Auger Analysis Pt Coverage Sample % Pt % Ga % N %C % O % Cl XÅ/25 Å 1 Å 7.7 34.3 19.1 30.6 7.1 1.3 0.13 3 Å 16.3 27.714.4 33.9 6.7 1.1 0.28 5 Å 27.3 21.0 10.6 34.5 5.4 1.2 0.47 10 Å  39.414.2 3.8 36.9 5.4 0.2 0.67 25 Å  58.7 2.0 2.3 33.0 3.7 0.3 1As is seen in Table 2, assuming that the 25 Å layer is a continuouslayer, then by Auger analysis, the 10 Å layer has about 67% coverage,the 5 Å layer has about 47% coverage, the 3 Å layer has about 28%coverage and the 1 Å layer has about 13% coverage. Accordingly, in someembodiments according to the present invention, the average thickness ofthe metal ohmic contact is related to the % of the p-type nitride layercovered by the metal ohmic contact.

Many alterations and modifications may be made by those having ordinaryskill in the art, given the benefit of the present disclosure, withoutdeparting from the spirit and scope of the invention. Therefore, it mustbe understood that the illustrated embodiments have been set forth onlyfor the purposes of example, and that it should not be taken as limitingthe invention as defined by the following claims. The following claimsare, therefore, to be read to include not only the combination ofelements which are literally set forth but all equivalent elements forperforming substantially the same function in substantially the same wayto obtain substantially the same result. The claims are thus to beunderstood to include what is specifically illustrated and describedabove, what is conceptually equivalent, and also what incorporates theessential idea of the invention.

1. A flip-chip semiconductor based Light Emitting Device (LED)comprising: an n-type semiconductor substrate; an n-type GaN epi-layeron the substrate; a p-type GaN epi-layer on the n-type GaN epi-layer; ametal ohmic contact p-electrode on the p-type GaN epi-layer, the metalohmic contact p-electrode comprising an average thickness less thanabout 25 Å; a reflector on the metal ohmic contact p-electrode; a metalstack on the reflector; an n-electrode on the substrate opposite then-type GaN epi-layer; and a bonding pad on the n-electrode.
 2. An LEDaccording to claim 1 wherein the metal ohmic contact comprises anaverage thickness less than about 20 Å.
 3. An LED according to claim 1wherein the metal ohmic contact comprises an average thickness of about13 Å to about 20 Å.
 4. An LED according to claim 1 wherein the metalohmic contact comprises an average thickness less than about 15 Å.
 5. AnLED according to claim 1 wherein the metal ohmic contact comprises anaverage thickness less than about 10 Å.
 6. An LED according to claim 5wherein an average thickness comprising about 25 Å or greater comprisesa metal ohmic contact p-electrode, wherein the metal ohmic contactp-electrode covers less than about 67% of the p-type GaN epi-layer. 7.An LED according to claim 1 wherein the metal ohmic contact comprises anaverage thickness less than about 5 Å.
 8. An LED according to claim 7wherein an average thickness comprising about 25 Å or greater comprisesa metal ohmic contact p-electrode, wherein the metal ohmic contactp-electrode covers less than about 47% of the p-type GaN epi-layer. 9.An LED according to claim 1 wherein the metal ohmic contact comprises anaverage thickness less than about 3 Å.
 10. An LED according to claim 9wherein an average thickness comprising about 25 Å or greater comprisesa metal ohmic contact p-electrode, wherein the metal ohmic contactp-electrode covers less than about 28% of the p-type GaN epi-layer. 11.An LED according to claim 1 wherein the metal ohmic contact comprises anaverage thickness of about 1 Å.
 12. An LED according to claim 11 whereinan average thickness comprising about 25 Å or greater comprises a metalohmic contact p-electrode, wherein the metal ohmic contact p-electrodecovers less than about 13% of the p-type GaN layer.
 13. An LED accordingto claim 1 wherein the reflector comprises a thickness greater thanabout 300 Å.
 14. An LED according to claim 13 wherein the reflectorcomprises aluminum and/or silver.
 15. A flip chip semiconductor basedLED comprising: a p-type nitride layer; a metal ohmic contactp-electrode on the p-type nitride layer, the metal ohmic contactp-electrode comprising an average thickness of less than about 25 Å; anda reflector on the metal ohmic contact p-electrode.